FUKKOL HEAT SINK COMPOUND APPLY FOR ELETRONIC

FUKKOL HEAT SINK COMPOUND APPLY FOR ELETRONIC
a metal oxide filled dielectric thermal transfer agent.
FUKKOL HEAT SINK COMPOUND APPLY FOR ELETRONIC
Description
Fukkol heat sink compound is a metal oxide filled dielectric thermal transfer agent. It is commonly used in electrical and electronic industries as a thermal transfer medium for facilitating heat dissipation between power components in electrical/electronic assemblies. And heat sink in the assembly process by filling the voids and gaps between the mated surfaces.

Characteristics

Temperature range

-40 °F(-40°C)to 400 °F(204°C)
Apperaance

White opaque

Bleed (204OC in 24 hrs)

1%MAX
NLGI Classification

1-2
Penetration (worked)

265-295
Evaporation(204OC in 24 hrs)

1%MAX
Water Resistance

Excellent
Thermal Conductivity

0.3
Specific Gravity

2.5