ArChine Synfluid SF 90

1,Solder Assist Fluid
2,Good Thermal Stability
3,Low Foam Tendency
4,Low Odor
Distributor Wanted
Product description
ArChine Synfluid SF 90 is a low viscosity, water soluble polyalkylene glycol fluid with excellent thermal stability. It is designed for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature stability and water washability are critical. ArChine Synfluid SF 90 does not contain any additives which could be deposited on the circuit board during aqueous cleaning procedures. ArChine Synfluid SF 95 is based on the same polyalkylene glycol polymer as ArChine Synfluid SF 90. It differs from ArChine Synfluid SF 90 in that it has been formulated with aproprietary additive package to further improve the product’s stability at high temperatures and to raise its flash point.


Product features
l Good Thermal Stability
l High Flash Point
l Excellent Water Washability
l Low Foam Tendency
l Low Odor
l High Product Clarity


ArChine Synfluid SF 90 and 95 have been found particularly useful in various heat transfer and blanketing applications. They are used to fuse Sn-Pb electroplate into solder-coating during fabrication and to “reflow” solder-coat and solder preform in assembly operations. ArChine Synfluid SF 90 and 95 are also used as hot liquid leveling fluids to smooth solder coatings and clear plated through-holes, and as blanketing fluids to protect liquid solder from oxidizing.

Typical physical properties
Property
ArChine Synfuid SF 90
ArChine Synfuid SF 95
Viscosiyt (cSt at 40°C)
90
90
(cSt at 100°C)
12
12
Specific Gravity (20/20°C)
1.151
1.152
Density (lbs/gal, 68°F)
9.57
9.59
(g/cm3, 20°C)
1.15
1.15
Pour Point (°F) (°C)
-29(-33.9)
<-30(<-34)
Flash Point, Closed cup (°F) (°C)
360(182)
535(279)
Open cup (°F) (°C)
535(279)
590(310)
Surface Tension (dynes/cm)
37.8
38.1
Water Solubility (25°C)
Complete
Complete
Cloud Point (°F) (°C)
>210(>99)
>210(>99)
(temperature above which a 1% aqueous solution of the product separates)